The flexible clamping function of semiconductor chip fixture first avoids mechanical damage to the chip through adjustable clamping force. The material of the chip is fragile, especially the ultra-thin chip and the precision circuit layer, which cannot withstand excessive external force. The flexible clamping design can automatically adjust the clamping force according to the thickness and material characteristics of the chip, ensuring that the chip is stably fixed without causing internal circuit breakage or surface cracking due to excessive pressure, providing basic protection for the chip from the perspective of force control.
This function uses special contact materials to reduce hard friction with the chip surface. The clamping part of the semiconductor chip fixture usually uses soft and wear-resistant polymer materials. The surface of this type of material is smooth and delicate, and it will not scratch the surface coating or solder joints when in contact with the chip. Even if there is a slight relative movement during the clamping process, the soft material can buffer the impact force generated by friction, avoid scratches on the chip surface or solder joints falling off, and protect the appearance and functional integrity of the chip.
The adaptive characteristics of the flexible clamping can fit the contours of chips of different shapes to avoid local force concentration. Some chips may have special-shaped structures or uneven edges due to design requirements. Traditional rigid clamping tends to apply excessive pressure on protruding parts. The flexible clamping function can maintain uniform force on each contact point of the chip through its own deformation, so that the pressure is dispersed on the entire contact surface, and stress concentration will not be formed in a certain part, thereby preventing the chip from cracking or deforming due to uneven force.
During the chip transfer process, the flexible clamping can buffer the impact of external vibration. When the chip is transferred from one station to another, the equipment operation may produce slight vibrations. The rigid clamping will directly transmit the vibration to the chip, resulting in relative displacement or even collision between the chip and the semiconductor chip fixture. The elastic material of the flexible clamping can absorb vibration energy like a spring, reduce the vibration force transmitted to the chip, and keep the chip stable during the transfer process, avoiding position displacement or accidental damage caused by vibration.
For chips with pins, the flexible clamping function can accurately protect the pins from damage. The pins of the chip are slender and densely arranged, and they may bend or break with a slight collision. Flexible clamping will avoid the pin area, or use a dedicated flexible contact to gently wrap the root of the pin, which ensures that the chip is fixed as a whole without touching the pin tip. It will not squeeze or pull the pin during movement or processing, ensuring the normal conductivity and connection function of the pin.
This clamping method can also adapt to temperature changes during chip processing and avoid thermal stress damage. Chips may experience temperature fluctuations during testing or processing. Different materials have different thermal expansion coefficients. Rigid clamping may cause sudden changes in clamping force due to thermal expansion and contraction. Flexible materials have good thermal stability and can deform slightly with temperature changes to maintain stable clamping force. They will not generate additional stress on the chip due to temperature changes, and protect the structural stability of the chip during temperature cycling.
In addition, the flexible clamping function reduces the error influence of manual operation and indirectly improves the chip protection effect. There is inevitably deviation in force control during manual clamping, while flexible clamping automatically controls the force through preset elastic parameters. Regardless of who the operator is, the clamping effect can be maintained consistently to avoid chip damage caused by excessive or insufficient human force. This stability ensures that chips are equally protected during batch processing, improving the overall production yield.
