Semiconductor chip packaging is a key link in the semiconductor manufacturing process, and the semiconductor chip fixture plays a vital role in this link.
Adaptation to different shapes and sizes: Whether it is a tiny chip or a large mechanical component, optical inspection equipment must be able to adapt.
BGA chips need to pay special attention to heat dissipation during welding, because excessive temperature and uneven heat distribution may cause chip damage or poor welding.
In modern manufacturing, the data analysis and recording functions of optical inspection equipment play a vital role.
With the rapid development of science and technology, the semiconductor chip manufacturing industry is ushering in unprecedented changes.
In the field of semiconductor manufacturing, chip fixtures are important tools to ensure stable and accurate clamping of chips during processing.